§ 850.218. Package.
35 words·~1 min read·
/us/cfr/t31/s§ 850.218·A research copy — for the controlling text, always check the official state or federal source. Not legal advice.
The term package means to assemble various components, such as the integrated circuit die, lead frames, interconnects, and substrate materials to safeguard the semiconductor device and provide electrical connections between different parts of the die.