§ 850.201. Advanced packaging.
50 words·~1 min read·
/us/cfr/t31/s§ 850.201·A research copy — for the controlling text, always check the official state or federal source. Not legal advice.
The term advanced packaging means to package integrated circuits in a manner that supports the two-and-one-half-dimensional (2.5D) or three-dimensional
(3D)assembly of integrated circuits, such as by directly attaching one or more die or wafer using through-silicon vias, die or wafer bonding, heterogeneous integration, or other advanced methods and materials.