Sec. 8. Advanced semiconductor research and design
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In this section, the term appropriate committees of Congress means— the Select Committee on Intelligence, the Committee on Commerce, Science, and Transportation, the Committee on Foreign Relations, the Committee on Armed Services, and the Committee on Homeland Security and Governmental Affairs of the Senate; and the Permanent Select Committee on Intelligence, the Committee on Energy and Commerce, the Committee on Foreign Affairs, the Committee on Armed Services, the Committee on Science, Space, and Technology, and the Committee on Homeland Security of the House of Representatives.
It is the sense of Congress that the leadership of the United States in semiconductor technology and innovation is critical to the economic growth and national security of the United States. The President shall establish in the National Science and Technology Council a subcommittee on matters relating to leadership of the United States in semiconductor technology and innovation. The duties of the subcommittee established under paragraph
(1)are as follows: In coordination with the Secretary of Defense, the Secretary of Energy, the Secretary of State, the Secretary of Commerce, the National Science Foundation, and the Director of the National Institute of Standards and Technology and in consultation with the semiconductor industry and academia, develop a national strategy on semiconductor research, including guidance for the funding of research. Not less frequently than once every 5 years, to update the strategy developed under clause
(i)and to submit the revised strategy to the appropriate committees of Congress. To foster the coordination of semiconductor research and development. The Secretary of Commerce may, in coordination with the private sector, establish in the Department of Commerce an institute on advanced packaging and manufacturing. The functions of the institute established under paragraph
(1)shall be as follows: To establish United States leadership in advanced microelectronic packaging. To promote standards development for such packaging. To foster public-private partnerships relevant to such packaging. To develop research and development programs to advance technology development relevant to such packaging. To establish an investment fund— to support a startup domestic advanced microelectronic packaging ecosystem; to accelerate technology transfer; and to ensure domestic supply chains; and to work with the Secretary of Labor and the private sector to develop workforce training programs and apprenticeships in advanced microelectronic packaging capabilities. There is authorized to be appropriated to establish a national semiconductor technology center to conduct research and prototyping of advance semiconductors with participation of the private sector, the Secretary of Defense, the Secretary of Energy, the National Science Foundation, and the Director of the National Institute of Standards and Technology, $3,000,000,000 for fiscal year 2021, with such amount to remain available for such purpose through fiscal year 2030. There is authorized to be appropriated to carry out the Electronics Resurgence Initiative of the Defense Advanced Research Projects Agency, $2,000,000,000 for fiscal year 2021, with such amount to remain available for such purpose through fiscal year 2025. There is authorized to be appropriated to carry out programs at the National Science Foundation on semiconductor basic research, $3,000,000,000 for fiscal year 2021, with such amount to remain available for such purpose through fiscal year 2025. There is authorized to be appropriated to carry out programs at the Department of Energy on semiconductor basic research, $2,000,000,000 for fiscal year 2021, with such amount to remain available for such purpose through fiscal year 2025. There is authorized to be appropriated to carry out subsection (d), $5,000,000,000 for fiscal year 2021, with such amount to remain available for such purpose through fiscal year 2025— of which, $500,000,000 shall be available to carry out paragraph (2)(D) of such subsection; and of which, $500,000,000 shall be available to carry out paragraph (2)(E) of such subsection.