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Code · Illinois · Chapter 20 — EXECUTIVE BRANCH · Act 2705

Sec. 2705-617. Student loan repayment assistance for engineers pilot program.

122 words·~1 min read·/il/chapter-20/act-2705/2705-617

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Sec. 2705-617. Student loan repayment assistance for engineers pilot program. The Department shall provide higher education student loan repayment assistance in the form of an annual after-tax bonus of $15,000 per year, for not more than 4 years, for up to 50 engineers employed by the Department, subject to the following:
(1)the engineer is a graduate of a college or university located in this State;
(2)the engineer provides documentation to the Department of the repayment of higher
education student loans taken to attend a college or university located in this State;
(3)the engineer has been employed by the Department for at least 4 years; and
(4)the engineer was hired by the Department on or after July 1, 2024.
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